MANUFACTURING PROCESS
Huiyang TECHWISE Industrial Technology Co.Ltd
Huiyang Economic Development Zone, Huizhou City,
Guangdong Province, China
Tel: (86) 752- 3500078
Fax: (86) 752- 3500306
TECHWISE(Fogang) Circuits Limited
Kingboard Industry Park, Shi Jiao Town, Fogang Country, Qing Yuan,
Guangdong Province, China
Tel: (86) 763- 4296800
Fax: (86) 763- 4287599
Download the full data :
Plant ParameterTECHWISE Shirai(Fogang) Circuits Limited
Town South Industry Park, Shi Jiao Town, Fogang Country, Qing Yuan,
Guangdong Province, China
Tel: (86) 763- 4201888
Fax: (86) 763- 4201308
Download the full data :
Plant Parameter
1. Cut to Size, Issue
★ Inner layer/Core shearing
2. Image Transfer/Etching(Inner layer)
★ Inner layer circuit manufacturing
★ Use dry film as etching resist
3. AOI/Test
★ AOI(Automatic Optical Inspection)in place of visual inspection
★ Fine circuit pattern inspection
4. Lamination
★ Copper foil + prepreg + inner layer(thin core)
★ High temperature pressure plus bacuum laminate
5. Drilling
★ With broken & missed drill bit detector
★ Drilling program down load directly from CAD/CAM data
6. Plate Through Hole/Panel Plating
★ Plated to required thickness
★ Connected conductivity between layer to layer
7. Image Transfer (Outer Layer)
★ Use automated exposure machine to transfer image from dry film
to laminate surface
★ Expose circuit pattern for plating: dry film cover etching
areas as plating resist
8. Pattern Plating
★ Plate 1.0 mil thick Cu
★ Plate 0.3 mil thick tin as etching resist
9. Dry Film Stripping/Etching/Solder Stripping
★ Strip dry film then etch copper area covered by dry film
★ Strip Tin on circuit pattern
10. Open/Short Test
★ Test program down load from CAD/CAM data through network
system
★ Test all point to point and isolated patterns function
11. Solder mask
★ LPI(Liquid Photo Imagable)which are UL approved
12. Electroless Nickel/Gold
★ Electroless Nickel & Immersion Gold On Copper
13. Gold Tab Plating
★ Automated Gold Tab Plating (0125-1.5 MICRON) thickness
14. Hot Air Leveling(HAL)
★ Horizontal HAL processing to get solder flatness of SMD pad
better and smoothness
15. Outline Finish
★ CNC routing /punch
★ V-cut
★ Edge connector chamfer(20-45 angular)
16. Final Test
★ High voltage 300 VDC OHM double sided test
17. Organic Coatcis
★ organic Coating on Copper
18. Packing
★ Vacuum or popular type